Semiconductor Equipment Corp. Model 8601 Manual Die Bonder Semiconductor System 146312618263 At 5GHz -5dBm

At 5GHz -5dBm

Buffer XBP Binding Buffer – 55 mL (approximately 3/4 bottle remaining)

Includes Infrasil Window and Case as pictured

Diaphragm Valve was pulled from a fully functional environment

Semiconductor Equipment Corp. Model 8601 Manual Die Bonder Semiconductor System 146312618263 At 5GHz -5dBmThis item will ship motor freight. Condition Used Description Includes: Semiconductor Equipment Corp. Model 8601 Manual Die Bonder Semiconductor System Omega DPi8 2x 8601 052 REV D Schott Fostec 20500 3x Panasonic GP KR222 Leica MZ95 Optem Controller A. G. Heinze DL 150 Gast DOA P704 AA Sylvania display Optem Stepping Motor Junction Box 30 17 74 Ushio 21V150W Halogen Reflector Lamp RadioShack 15 1982 Video Selector Dell Keyboard Viteris SPR Push